properties

Dow launches new electromagnetic interference shielding technologies

Dow returns to The Battery Show Europe this year to showcase its broad and growing portfolio of conductive silicone technologies with the launch of DowSil EC-6601 Electrically Conductive Adhesive.

This next-generation material is engineered for reliable performance and electromagnetic compatibility in various transportation, communications and consumer electronics applications.

It combines strong shielding against electromagnetic interference across a wide range of frequencies with durable mechanical and conductive properties over time.

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New solder paste enables further miniaturisation in automotive electronics

For the production of miniaturised electrical systems, such as those used in the automotive industry, solder material must meet extremely high requirements.

In response, Heraeus Electronics has developed its new solder paste Microbond SMT650, which it says guarantees consistently high surface resistance.

The combination of the new F650 flux system with the Innolot metal alloy increases reliability and prevents electrochemical migration even under the most extreme environmental conditions.

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