Robotics & Automation News

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Scania teams up with Combient network to tap into ‘huge potential’ of automation and AI

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Scania says its partnership with the Combient Foundry is intended to tap into the “huge potential” of automation and artificial intelligence in the transportation industry.

The Combient network, which Scania is part of, is a cross-Nordic industry collaboration that aims to accelerate transformation in areas like automation, artificial intelligence, analytics and open innovation.

A part of Combient is the Foundry which connects startups with Nordic industry leaders, enabling the co-creation of new services and solutions. [Read more…] about Scania teams up with Combient network to tap into ‘huge potential’ of automation and AI

Fanuc to demonstrate cobots and automation technology at Westec 2019

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Fanuc America, supplier of robotics, CNCs and robomachines will demonstrate robotic and automation solutions for the aerospace, medical, industrial machinery and consumer goods industries at Westec 2019, 24-26 September in Long Beach, California, USA.

It will show the Fanuc CR-15iA collaborative robot, which uses iRVision to locate a part and then loads it into a chuck to simulate machining. The robot unloads the part and the cycle repeats.

Fanuc’s CR-7iA collaborative robot will demonstrate a variety of pre-programmed movements. Visitors will be able to use the hand-guidance mode, which allows them to instruct the robot to perform different movements and record paths.

[Read more…] about Fanuc to demonstrate cobots and automation technology at Westec 2019

New solder paste enables further miniaturisation in automotive electronics

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For the production of miniaturised electrical systems, such as those used in the automotive industry, solder material must meet extremely high requirements.

In response, Heraeus Electronics has developed its new solder paste Microbond SMT650, which it says guarantees consistently high surface resistance.

The combination of the new F650 flux system with the Innolot metal alloy increases reliability and prevents electrochemical migration even under the most extreme environmental conditions.

[Read more…] about New solder paste enables further miniaturisation in automotive electronics

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