For the production of miniaturised electrical systems, such as those used in the automotive industry, solder material must meet extremely high requirements.
In response, Heraeus Electronics has developed its new solder paste Microbond SMT650, which it says guarantees consistently high surface resistance.
The combination of the new F650 flux system with the Innolot metal alloy increases reliability and prevents electrochemical migration even under the most extreme environmental conditions.
Cars today are rolling technology giants. To accommodate all the electronics necessary means that individual components must be smaller than ever.
Miniaturisation – and the corresponding ever shrinking distances between the conductor paths – lead to higher electrical field strengths. This increases the risk of electrochemical migration.
The company claims the new solder paste Microbond SMT650 is the solution to this problem.
Electrochemical migration, a form of corrosion, affects the reliability and service life of electronic assemblies.
The phenomenon is caused by moisture – either during the manufacture of printed circuit boards or due to external influences.
An example of this is the control unit in a vehicle, where temperature fluctuations can lead to condensation.
The moisture deposited on the printed circuit boards, in combination with flux residues and increased electric field strength, can lead to negative interactions. So-called dendrites form and can ultimately lead to a short circuit.
To prevent this, Microbond SMT650 offers a consistently high surface resistance that prevents the risks of electrochemical migration.
“With the F650 flux system, we have found a very good balance between wetting under nitrogen reflow, excellent pressure properties, and surface resistance,” explains Manu Noé Vaidya, Product Manager at Heraeus Electronics.
In addition, Microbond SMT650 is compatible with many protective lacquers for electronics and printed circuit boards.