Where Innovation Meets Imagination
Scientists have made a microprocessor using carbon nanotubes – not silicon.
As reported by Science News, the innovation marks a milestone in computing.
The prototype chip is said to be slower than equivalent silicon-based processors and is not as small. [Read more…] about Scientists make chip using carbon nanotubes instead of silicon
Smartphones that don’t scratch or shatter. Metal-free pacemakers. Electronics for space and other harsh environments.
These could all be made possible thanks to a new ceramic welding technology developed by a team of engineers at the University of California San Diego and the University of California Riverside.
The process, published in the August 23 issue of Science, uses an ultrafast pulsed laser to melt ceramic materials along the interface and fuse them together. [Read more…] about New lasers can weld ceramics without furnace, claim scientists
Drive World Conference & Expo, a showcase bringing together the brightest minds across the automotive electronics and intelligence industries, has released its 2019 conference content.
Spanning four distinct tracks, the conference features an ideal forum to share knowledge related to system connectivity, sensing technologies, infotainment, safety, security, smart mobility, and more.
Drive World, partnered with the Embedded Systems Conference, an event with a 30-year legacy of influencing electronics design and innovation, will take place August 27-29 at the Santa Clara Convention Center in Santa Clara, California. [Read more…] about Event to highlight the shift toward connected autonomous vehicles
Arrow Electronics has announced a global agreement with Infineon and Arkessa that will further extend Arrow’s ability to support customers with cellular communications for the Internet of Things (IoT).
Security remains one of the top concerns for organisations for connected devices. Infineon provides the secured hardware controllers based on GSMA’s Embedded Subscriber Identity Module (eSIM) specification that underpin the new service.
Arkessa provides secured mobile data services with the ability to provision and manage IoT devices from the factory into the field.
[Read more…] about Arrow Electronics, Infineon and Arkessa partner on connectivity for IoT devices
The Harting Technology Group and US company Heilind Electronics have entered into a global partnership. The agreement was signed at the “electronica” trade fair in Munich.
Heilind is a leading distributor of connectors and electromechanical components. Featuring over 170 manufacturers, including most leading connector manufacturers, Heilind boasts an extensive product portfolio.
With Heilind, Harting would like to continue the already successful partnership in North America now also in other countries worldwide.
[Read more…] about Harting and Heilind Electronics enter into global partnership
Dow returns to The Battery Show Europe this year to showcase its broad and growing portfolio of conductive silicone technologies with the launch of DowSil EC-6601 Electrically Conductive Adhesive.
This next-generation material is engineered for reliable performance and electromagnetic compatibility in various transportation, communications and consumer electronics applications.
It combines strong shielding against electromagnetic interference across a wide range of frequencies with durable mechanical and conductive properties over time.
[Read more…] about Dow launches new electromagnetic interference shielding technologiesIndustrial motors giant Nidec is planning to build a $500 million facility in China, according to a report on Nikkei.
The factory will specialize in manufacturing motors for electric vehicles, a growing market in China and the rest of the world.
The proposed location is said to be the Jinpu New Area in the port city of Dalian, north-east China, about 500 km east of Beijing.
[Read more…] about Nidec to build $500 million facility in China to make motors for electric vehiclesFor the production of miniaturised electrical systems, such as those used in the automotive industry, solder material must meet extremely high requirements.
In response, Heraeus Electronics has developed its new solder paste Microbond SMT650, which it says guarantees consistently high surface resistance.
The combination of the new F650 flux system with the Innolot metal alloy increases reliability and prevents electrochemical migration even under the most extreme environmental conditions.
[Read more…] about New solder paste enables further miniaturisation in automotive electronicsSamsung Electronics, a world leader in advanced semiconductor technology, will invest KRW 133 trillion (US$115 billion) by 2030 to strengthen its competitiveness in System LSI and Foundry businesses.
The investment plan is expected to help the company to reach its goal of becoming the world leader in not only memory semiconductors but also logic chips by 2030.
The company also plans to create 15,000 jobs in R&D and production to bolster its technological prowess.
[Read more…] about Samsung Electronics to invest $115 billion in logic chip businesses by 2030Arrow Electronics, Inc. will take part in the Smart Cities Accelerator Program of Qualcomm Technologies, Inc. for the global acceleration of edge compute, 5G appliances and NB-IoT distributed sensors.
Qualcomm Technologies is promoting a library of Smart City solutions that combine existing mobile broadband networks while re-imagining existing infrastructure in cities around the world.
This will help drive additional value and integrate solutions with secure interoperability, edge processing and an ecosystem to deploy at scale.
[Read more…] about Arrow Electronics to take part in Qualcomm’s Smart Cities Accelerator Program
