Infineon Technologies has unveiled what it describes as “the next milestone’ in semiconductor manufacturing technology.
Infineon says it has reached a “breakthrough” in handling and processing “the thinnest silicon power wafers ever manufactured”, with a thickness of only 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab.
The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometers.
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