Infineon has started shipping what it says is “the world’s first industrial-grade embedded SIM in a miniaturized package”.
Infineon’s new chip is than 3mm x 3mm and is designed for a wide range of applications.
Machine-to-machine communication in the internet of things requires reliable data collection and uninterrupted data transmission. [Read more…] about Infineon ships ‘world’s first industrial-grade eSIM in miniaturized package’
