Canon Inc. has begun selling the FPA-5520iV HR Option, a high-resolution addition for the Canon FPA-5520iV i-line stepper used in back-end semiconductor lithography processes.
New HR Option steppers also inherit such features as enhanced functionality for Fan-Out Wafer Level Packaging (FOWLP) and increased productivity for semiconductor manufacturing processes.
As mobile devices become increasingly compact and energy-efficient, suppliers need to produce semiconductor chips that are thinner with a larger surface area.
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