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Canon to offer SoftBank’s robotic vacuum cleaner Whiz to offices

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Canon Solutions America has formed a new strategic collaboration with SoftBank Robotics America and will provide the Whiz robotic vacuum cleaner to offices as part of the agreement.

The alliance initiates a new focus on commercializing robotics and integrated automation as part of Canon Solutions America’s larger Workplace Health Solutions portfolio, starting with Whiz, which is described as “the commercial robot vacuum that works to elevate the health and safety of varying work environments”.

The Whiz offering brings together Canon Solutions America’s industry-leading solutions and exceptional professional services with SoftBank Robotics’ global leadership in collaborative robotics, or cobotics, and impactful automation. [Read more…] about Canon to offer SoftBank’s robotic vacuum cleaner Whiz to offices

Canon launches new semiconductor lithography system

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Canon has launched the FPA-8000iW, which it describes as the first Canon semiconductor lithography system to support manufacturing using large panels that are common in back-end processing.

Integrating a proprietary projection optical system, the FPA-8000iW i-line stepper offers a wide exposure field and fine 1 µm† pattern resolution.

The FPA-8000iW was designed to meet the needs of manufacturers aiming for high production efficiency through the use of 515 x 510 mm organic panel substrates for Panel Level Packaging (PLP) applications. [Read more…] about Canon launches new semiconductor lithography system

Canon launches FPA-5520iV HR option for back-end i-line steppers

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Canon Inc. has begun selling the FPA-5520iV HR Option, a high-resolution addition for the Canon FPA-5520iV i-line stepper used in back-end semiconductor lithography processes.

New HR Option steppers also inherit such features as enhanced functionality for Fan-Out Wafer Level Packaging (FOWLP) and increased productivity for semiconductor manufacturing processes.

As mobile devices become increasingly compact and energy-efficient, suppliers need to produce semiconductor chips that are thinner with a larger surface area.

[Read more…] about Canon launches FPA-5520iV HR option for back-end i-line steppers

Canon develops ceramic material for 3D printing

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Canon Inc. has developed a manufacturing technology for the highly accurate 3D printing of ceramic parts with complex geometries using a proprietary ceramic material for 3D printers.

The 3D printed ceramic parts feature such properties of conventional ceramics as heat and corrosion resistance as well as insulating properties, and are expected to be used in a variety of different fields, including industrial equipment.

3D printers that use such materials as metal and resin, which enable easy prototyping and the production of a variety of parts in small lots, have started to become more common.

[Read more…] about Canon develops ceramic material for 3D printing

Canon partners Aveva on imaging technologies for smart factories

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Canon Inc.  is starting a partnership with Aveva Group plc on smart factories through Canon imaging technologies to achieve “factory visualisation.”

The technology partnership will combine Aveva capabilities, including industrial automation and information management software, with Canon’s imaging technology.

Aveva’s InTouch SCADA1 system will be integrated with Canon products such as network cameras, industrial cameras and software for production centres to create new value based on video and image processing technologies employed on factory floors.

[Read more…] about Canon partners Aveva on imaging technologies for smart factories