Teradyne, Inc. has announced the new Universal Protocol Board (UPBx), a module for its Magnum VU memory test system that enables testing of high-speed memory devices, popular in cutting edge mobile phones and tablets.
As mobile devices offer higher resolution video, virtual reality (VR) and augmented reality (AR) applications, they are adopting higher speed NAND storage based on the Universal Flash Storage (UFS) 3.0.
UFS 3.0 devices feature interface speeds up to 16Gbps per lane for real-time application performance such as faster boost, faster multimedia and higher gaming performance.
Teradyne has miniaturised the UPBx to eliminate the traditional cabling between the test instrument and device under test (DUT).
Instead, the UPBx is directly docked to the socket board. This Near DUT Test (NDT) architecture dramatically shortens the signal path, increasing performance, reducing latency and providing better emulation of the real system environment.
Magnum VU is a flexible, superset test platform that proves the performance and functionality of all NAND products, both cutting edge UFS 3.0 and PCIe Gen 4 mobile and automotive devices, as well as legacy NAND products such as UFS 2.1, PCIe Gen 3, e.MMC, ONFI and Toggle.
Raw NAND for the solid-state drive (SSD) storage is also supported for enterprise and data centre servers and personal computers.
Based on competitive benchmarks, Teradyne says the new UPBx makes Magnum VU the industry’s highest performance, highest throughput NAND Protocol test platform.
The UPBx is the direct replacement for Teradyne’s first generation UPB instrument.