TDK Corporation is working with Qualcomm Technologies, Inc. through its group company, InvenSense, to contribute a product portfolio of MEMS motion and audio sensor solutions to the new Qualcomm Robotics RB3 Platform.
Based on the Qualcomm SDA/SDM845 system-on-chip (SoC), the Qualcomm Robotics RB3 platform is a set of hardware, software and tools designed to help manufacturers and developers create advanced consumer, enterprise and industrial robotics products.
The platform will support InvenSense’s 6-axis IMUs (3-axis gyroscope and 3-axis accelerometer), capacitive barometric pressure sensor, and multi-mode digital microphones.
The Qualcomm Robotics RB3 Platform also integrates two InvenSense IMU sensors able to quantify external real-time clock measurements to provide a high degree of precision, and includes support for relative accuracy pressure sensors capable of measuring 10 cm of elevation difference.
The RB3 platform also integrates InvenSense microphones. Multi-mode microphones are ideal in ‘AlwaysOn’ robotic applications where low power, high fidelity, tight sensitivity matching and high acoustic overload point (AOP) are important.
“The Qualcomm Robotics RB3 Platform provides a new platform for the development of innovative new robotics products,” said Dev Singh, director of business development and head of autonomous robotics, drones and intelligent machines at Qualcomm Technologies, Inc.
“The platform takes full advantage of InvenSense’s high-performance sensors – sensors that are important for many applications in robotics, from industrial robots to enterprise service bots to personal consumer products.”