NXP to supply RoadLink chipsets for secure vehicle-to-x communications in Korea’s next-generation intelligent transportation system project
NXP Semiconductors and eSSys will be technology partners in Korea’s next-generation Cooperative Intelligent Transportation System (C-ITS) project promoted by the Korean Ministry of Land, Infrastructure and Transport.
NXP will supply eSSys with its RoadLink V2X chipset, a vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2X) communication and security solution which will be test-operated on an 87.8 km route between Sejong City (city of government offices) and Daejon. The year-long pilot operation started this month.
Currently, a variety of smart transport technologies are being installed on national highways, including the primary highway for access to the 2018 Winter Olympic Games in Pyeongchang. [Read more…] about NXP and eSSys to deliver intelligent transport systems for Korean government project