TDK Corporation is working with Qualcomm Technologies, Inc. through its group company, InvenSense, to contribute a product portfolio of MEMS motion and audio sensor solutions to the new Qualcomm Robotics RB3 Platform.
Based on the Qualcomm SDA/SDM845 system-on-chip (SoC), the Qualcomm Robotics RB3 platform is a set of hardware, software and tools designed to help manufacturers and developers create advanced consumer, enterprise and industrial robotics products.
The platform will support InvenSense’s 6-axis IMUs (3-axis gyroscope and 3-axis accelerometer), capacitive barometric pressure sensor, and multi-mode digital microphones.
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