Day: April 11, 2018

  • Dynamic vision sensors and event cameras could reduce machine perception’s computing workload

    Dynamic vision sensors and event cameras could reduce machine perception’s computing workload

    Rewired’s Santiago Tenorio and Jae Yong-Lee explain dynamic vision sensors and event cameras in this exclusive interview Just about every machine that moves requires some sort of sensing technology which informs it of its exact location and its position within its environment and its proximity to other objects within that environment.  One of the most…

  • Robotic spine exoskeleton paves the way for new spine deformity treatments

    Robotic spine exoskeleton paves the way for new spine deformity treatments

    Columbia Engineering researchers have invented a new Robotic Spine Exoskeleton (RoSE) that may lead to new treatments for spine deformities. Spine deformities, such as idiopathic scoliosis and kyphosis (also known as “hunchback”), are characterized by an abnormal curvature in the spine. The children with these spinal deformities are typically advised to wear a brace that…

  • Yaskawa introduces Sigma SD spindle drive

    Yaskawa introduces Sigma SD spindle drive

    The Drives & Motion Division of Yaskawa America, Inc. has introduced the Sigma SD line of spindle drive systems. The new product was created to bring a notable increase in precision and productivity to automated machining equipment. Sigma SD draws upon the technical advances of Yaskawa’s Sigma Series servo systems to meet the specialized demands…

  • TI collaborates with Heidenhain on first industrial drive control system-on-chip

    TI collaborates with Heidenhain on first industrial drive control system-on-chip

    Texas Instruments (TI), with help from Heidenhain, has developed a microcontroller (MCU) for the semiconductor industry—the C2000TM MCU. The C2000 offers the Heidenhain EnDat 2.2 interface as an option and delivers a complete solution with a direct connection for industrial motor and servo drives, supporting both analog and digital position sensors. When combined with TI’s…