Chipmakers Qualcomm and NXP Semiconductors have reportedly agreed a $40 billion takeover deal, according to CNBC.
Wall Street Journal reported a couple of weeks ago that Qualcomm was in negotiations to buy NXP for $30 billion, and TechCrunch.com says the acquisition would be “a huge consolidation move for the silicon industry”.
Neither company has so far commented on the talks, and have not confirmed they are taking place.
But now, CNBC is confident that Qualcomm and NXP “have agreed an all-cash handshake deal that Qualcomm will pay $110 a share for NXP … in a deal that would be close to $40 billion”.
Qualcomm has a market capitalisation of more than $100 billion, and earned over $25 billion in revenue in 2015. The company has 27,000 staff and is headquartered in California, in the US.
NXP is valued at $35 billion and had revenues of $6 billion in 2015. It has 45,000 staff and is headquartered in the Netherlands, Europe.
NXP to supply RoadLink chipsets for secure vehicle-to-x communications in Korea’s next-generation intelligent transportation system project
NXP Semiconductors and eSSys will be technology partners in Korea’s next-generation Cooperative Intelligent Transportation System (C-ITS) project promoted by the Korean Ministry of Land, Infrastructure and Transport.
NXP will supply eSSys with its RoadLink V2X chipset, a vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2X) communication and security solution which will be test-operated on an 87.8 km route between Sejong City (city of government offices) and Daejon. The year-long pilot operation started this month.
Columbus to use NXP solutions, including real-time vehicle-to-vehicle and vehicle-to-infrastructure communication systems and secure public transportation smart cards for a more intelligent urban transportation system
NXP Semiconductors says its technologies for smart cities, including sophisticated vehicle communications solutions, RFID tagging and Smart Card ICs, play a key role in Columbus, Ohio’s winning proposal for the US Department of Transportation’s (DoT) Smart City Challenge.
NXP, through its partnership with the DoT, is working with Columbus to help deploy wireless technology allowing cars to securely exchange data, prevent accidents and improve traffic flow, as well as Smart Card ICs to make secure public transportation access fast and easy for credit- and cash-economy-based passengers alike. Continue reading NXP to provide smart city technologies to Columbus
Dutch government organising DAF technology demonstration to put fleets of autonomous trucks on European roads
A consortium of DAF Trucks, TNO, NXP and Ricardo is working together under the name EcoTwin to participate in the European Truck Platooning Challenge being organised by the Dutch Ministry of Infrastructure and the Environment on April 6.
NXP Semiconductors has upgraded its Software Development Kit (SDK) for Kinetis microcontrollers (MCUs) to offer support for home automation applications using Apple HomeKit technology.
Utilising the performance and Bluetooth Smart connectivity of NXP’s Kinetis products, the solution streamlines development for a wide range of HomeKit compatible products.
HomeKit is a framework in iOS that lets accessories connect seamlessly so people can better manage their homes. It offers a set of common protocols which enable accessories to work together easily and securely, and allows consumers to control them simply using Siri. Continue reading NXP adds Apple HomeKit support to its SDK
NXP Semiconductors has joined the US Department of Transportation’s Smart City Challenge as a provider of vehicle-to-vehicle and vehicle-to-infrastructure (V2X) technology.
With this partnership, NXP, together with its partner Cohda Wireless, will provide the contest’s winning community with wireless technology that allows cars to securely exchange data, such as hazard warnings, over distances of more than a mile to prevent accidents and improve traffic flow.
The Smart City Challenge is a nationwide competition set to award the winning, medium-sized US city a prize of $50 million through the DoT and its partners, for that city’s ideas to develop the connected city of the future and address the challenges that growing populations present to transportation infrastructure. Continue reading NXP enters US DoT’s vehicle-to-x Smart City Challenge
Harman International Industries is planning to demonstrate its Connected Car Compute Platform for advanced, holistic vehicle intelligence with vehicle-to-x capability (V2X) based on RoadLink technology from NXP Semiconductors.
The wireless technology significantly improves road safety by alerting drivers of critical traffic situations well beyond the range of current production sensors, allowing drivers to “see” around corners, and through traffic obstacles such as big trucks ahead.
“Harman leads the industry as an end-to-end system integrator for automakers and technology suppliers to provide drivers intelligent, adaptable and predictive solutions in the car. We are proud to collaborate with NXP for a flexible and secure V2X solution as part of our leading compute platform to dramatically improve not only safety, but comfort and convenience,” said Phil Eyler, president, Harman connected car division. Continue reading Harman and NXP to demonstrate secure vehicle-to-x communication technology
NXP and Xiaomi have agreed a mobile payments technology deal for public transit systems in China, a country with some plans for intelligent transport networks.
As a key part of the deal, Xiaomi integrated NXP’s Secure Element and Near Field Communication (NFC) solution into its next-generation flagship Mi 5 smartphone, which the companies believe will help accelerate the adoption of mobile payments in China.