NXP to supply RoadLink chipsets for secure vehicle-to-x communications in Korea’s next-generation intelligent transportation system project
NXP Semiconductors and eSSys will be technology partners in Korea’s next-generation Cooperative Intelligent Transportation System (C-ITS) project promoted by the Korean Ministry of Land, Infrastructure and Transport.
NXP will supply eSSys with its RoadLink V2X chipset, a vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2X) communication and security solution which will be test-operated on an 87.8 km route between Sejong City (city of government offices) and Daejon. The year-long pilot operation started this month.
Currently, a variety of smart transport technologies are being installed on national highways, including the primary highway for access to the 2018 Winter Olympic Games in Pyeongchang. Continue reading NXP and eSSys to deliver intelligent transport systems for Korean government project